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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 tsz22111 ? 14 ? 001 www.rohm.com bm1r00001 1 1.3 bm1r00002 1 2 bm1r00003 1 3 bm1r00004 1 3.6 bm1r00005 1 4.6 bm1r00006 1.5 1.3 bm1r00007 1.5 2 bm1r00008 1.5 3 bm1r00009 1.5 3.6 bm1r00010 1.5 4.6 bm1r00011 2.3 1.3 bm1r00012 2.3 2 bm1r00013 2.3 3 bm1r00014 2.3 3.6 bm1r00015 2.3 4.6 bm1r00016 2.8 1.3 bm1r00017 2.8 2 bm1r00018 2.8 3 bm1r00019 2.8 3.6 bm1r00020 2.8 4.6 bm1r00021 3.5 1.3 bm1r00022 3.5 2 bm1r00023 3.5 3 bm1r00024 3.5 3.6 bm1r00025 3.5 4.6 bm1r00026 none 1.3 bm1r00027 none 2 bm1r00028 none 3 bm1r00029 none 3.6 bm1r00030 none 4.6 function name compulsion on time ( s compulsion off time ( s bm1r00121 1 1.3 bm1r00122 1 2 bm1r00123 1 3 bm1r00124 1 3.6 bm1r00125 1 4.6 bm1r00126 1.5 1.3 bm1r00127 1.5 2 bm1r00128 1.5 3 bm1r00129 1.5 3.6 bm1r00130 1.5 4.6 bm1r00131 2.3 1.3 bm1r00132 2.3 2 bm1r00133 2.3 3 bm1r00134 2.3 3.6 bm1r00135 2.3 4.6 bm1r00136 2.8 1.3 bm1r00137 2.8 2 bm1r00138 2.8 3 bm1r00139 2.8 3.6 bm1r00140 2.8 4.6 bm1r00141 3.5 1.3 bm1r00142 3.5 2 bm1r00143 3.5 3 bm1r00144 3.5 3.6 bm1r00145 3.5 4.6 bm1r00146 none 1.3 bm1r00147 none 2 bm1r00148 none 3 bm1r00149 none 3.6 bm1r00150 none 4.6 function name compulsion on time ( s compulsion off time ( s l ow consumption and high accuracy shunt regulator built- in high efficiency and l ow standby power, ccm corresponding secondary side synchronous rectification controller ic bm1r00xxxf general description bm1r00xxxf is a synchronous rectification controller to be used in the secondary-side output. it has a built - in ultra- low consumption and high accuracy shunt regulator , which significantly reduces standby power . t he shunt regulator is constructed in a completely independent chip that enables it to operate as a gnd reference even when used in h igh side. at continuous mode operation, further space saving can be realized when operating without the input switching synchronizing signal of the primary side. bm1r00xxxf also features a wide operating power supply voltage range of 2. 7v to 32v for various output applications. finally , by adopting the high-voltage 120v process , it is possible to monitor the drain voltage directly. features ? built- in ultra-l ow consumption s hunt regulator r educ ing standby power consumption ? synchronous rectification fet supports high and low side ? 120v high voltage process drain terminal ? wide i nput operating voltage r ange of 2. 7v to 32v ? supports llc and pwm qr controller ? no input required on the primary-side at ccm ? built-in overvoltage protection for sh_in and sh_out terminal ? built-in thermal shutdown function ? built-in auto shutdown function ? sop8 package applications ? ac - dc output power conversion applications: charger , adapter, tv, rice cooker, humidifier, air conditioning , vacuu m cleaner , etc. key specifications ? input voltage range: 2. 7v to 32 v ? circuit current (no switching ): 800a(typ) ? circuit current (auto shutdown) : 120a (typ) ? drain terminal absolute voltage: 120v ? operating temperature range: - 40 c to +105c package w(typ) x d(typ) x h(max) 5.00mm x 6.20mm x 1. 71 mm lineup table latch protection series auto restart protection series sop8 datashee t downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///
2/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf sh_in sh_out sh_gnd gate 8 6 5 1 2 3 4 drain vcc 7 sr_gnd max_ton typical application circuits pin configuration pin description pin no. pin name function 1 vcc power s upply 2 sh_in shunt regulator reference 3 sh_out shunt regulator output 4 sh_gnd shunt regulator ground 5 max_ton set maximum o n time 6 gate gate drive 7 sr_gnd synchronous rectification ground 8 drain drain monitor low side application (flyback) high side application (flyback) (top view) + - v out primary controler gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton + - v out primary controler gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton downloaded from: http:///
3/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf block diagram v out primary side controller + - + - -100mv s q r + - vccx1.4 compulsion on time -6mv max_ton block max_ton vcc driver gnd ldo block + - sh_in + - 0 . 8 v sh_out protection block ? sh_out_ovp ? sh_in_ovp ? tsd drain gate sr_gnd drain_comp set_comp reset_comp shunt_regulator auto shutdown block compulsion off time timer latch 2 k o h m sh_gnd bm1r00001- 030 : include timer latch bm1r00121-150: without timer latch downloaded from: http:///
4/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf description of block 1. set_comp block monitors the drain terminal voltage , and outputs a signal to turn on the fet if the drain terminal vol tage is less than or equal to -100mv (typ). 2. reset_comp block monitors the drain terminal voltage and outputs a signal to turn off the fet if the drain terminal voltage is more than or equal to -6mv (typ). 3. compulsion on time block when the fet is turned on due to set_comp detection , noise occurs on the drain terminal . to prevent the noise from turning off the fet, an on state should be forced for a cert ain time. compulsion on time is within a range of 0s (none) to 3.5s, which is different for each series number (refe r to p age .1 table). 4. compulsion off time block when the fet is turned off due to reset_comp detection , resonance waveforms appear on the drain terminal . to prevent the noise from turning on the fet, an off state shou ld be forced for a certain time. compulsion off time is within a range of 1.3s to 4.6 s , which is different for each series number (refer to page.1 tab le). operation sequence of each block is shown on the figure belo w . about maximum i nput frequency the maximum operating frequency of the ic depends on the compulsion on/off time . for example, bm1r00026f and bm1r00146f compulsion on and off time is both equal to 0 s. considering a variation of 9% , the maximum input frequency is given by the following : f max = 1 / ((0s + 1.3s x 1.09) = 706khz however , since the frequency varies greatly due to the input voltage a nd load, it will be necessary to select the series in accordance with each application. 0v d r a i n s e t c o m p o n o n v g a t e 0v 0v r e s e t c o m p r e s e t 0v o n -100mv r e s e t -6mv -6mv vout c o m p u l s i o n o n t i m e 0v o n t i m e 0v o f f t i m e o n t i m e o f f t i m e -100mv -100mv -6mv -6mv c o m p u l s i o n o f f t i m e o n -100mv figure 1 . operation sequence downloaded from: http:///
5/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf 0v -100mv -100mv max_ton timer compulsion off timer start compulsion off timer start -vf description of block C continued 5. max_ton block max_ton block sets the maximum on time. drain terminal volta ge starts counting when the rising edge of the output voltage exceeds v cc 1.4v (typ). in addition, the recou nt ing starts when it detects another r ising edge . the synchronous rectification fet will be forced off after the s et time has elapsed. the time can be adjusted by vary ing the resistance value of the resistor connected to the max_ton term inal. the relationship between the resistance value (r max_ton ) and set time (t max_ton ) is described as follows: calculation example: if you want to set the maximum on time to 10s, the value of r max_ton is as follows: however, the formula above is for an ideal approximation only; it is still strongly advised that the operation of the actual application should still be verified. by setting this time , it becomes possible to prevent the simultaneous on operation of the primary side and the secondary side in continuous mode. t he drive sequence in continuous mode operation is shown i n the figure below: a capacitor c 1 and a moreover , in order to reduce as much as possible the influence of the switching noise , resistor r 1 in series should be connected to the max_ton terminal . the capacitance should approximately be 1000pf, and the resistance value is recommended to be around 1k. this also serves as phase compensation of max_ton terminal and therefore should be connected. this function may be disabled by pulling up the max_to n terminal to vcc pin in quasi-resonant and current resonance applications which do not operate on conti nuous mode. the 1000pf and 1k resistor is also unnecessary. 6. auto shutdown block the auto shutdown block automatically turns the synchronous rectification on/off depending on the presence or absence of the drain terminal pulse. shutdown occurs if the input pu lses on the drain terminal has more than 200us between pulses. this stops the synchronous rectificatio n operation. the ic will restart the synchronous rectificati on after it detects 256 occurrences of input pulses on the drain terminal. 7. shunt regulato r chip a high-accuracy shunt regulator with ultra-low consumption is used for controlling the output voltage of the ac/dc . since the synchronous rectification and the shunt regulator a re built in a completely different chip , gnd separation is possible . therefore , it becomes possible to place the shunt regulator on the secondary-side gnd reference in the synchronous rectification applications in case of dispo sing the high side fet. it can also be used as protection for the comparator , the secondary side ovp, f et overheat protection, etc. 8. protection block when an abnormal condition is detected after the timer count is completed, the photo coup ler from sh_out terminal is driven to stop the switching operation on the primary side. (1) primary side fet = on. current i 1 flows to the primary side fet. secondary side drain voltage v ds2 rises. (2) the v ds2 = v cc 1.4 detects the rise edge of the threshold, max_ton timer start. (3) primary side fet = off. current i 2 flows through the body diode of the secondary side fet (off state ). (4) secondary side drain voltage v ds2 100mv by i 2 current, secondary side fet=on. (5) elapsed the set time in max_ton terminals , the secondary-side fet = compulsory off. (6) since the i 2 current flows through the body diod e, v f voltag e occurs. ? ? ? ? ? ? k s k s 100 / 10 10 ? ? ? ? ? ? ? s k s t k r ton max ton max ? / 10 _ _ ? ? ? ? (1) (2) (3) (4) (6) (5) (1) period allotted for g 1 and g 2 to avoid concurrent on state at continuous mode operation. v ds2 i 1 i 2 vg 1 vg 2 t max_on t max_on v cc x 1.4 v out primary side controller + - + - -100mv s q r + - vccx1.4 compulsion on time -6mv max_ton block max_ton vcc driver gnd ldo block + - drain gate sr_gnd drain_comp set_comp reset_comp compulsion off time v g1 i 1 i 2 v ds2 v g2 np ns vh r max_ton r 1 c 1 v f d 1 r drain1 r drain2 l fb figure 2 . the drive sequence in continuous mode operation downloaded from: http:///
6/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf absolute maximum ratings (ta = 25c) parameter symbol rating unit vcc input voltage v max_vcc -0.3 to +40 (n ote 1) v max_ton input voltage v max_max_ton -0.3 to +40 (n ote 1) v sh_in input voltage v max_sh_in -0.3 to + 40 (n ote 2) v sh_out input voltage v max_sh_out -0.3 to + 40 (n ote 2) v gate input voltage v max_gate -0.3 to 15.5 (n ote 1) v drain input voltage v max_drain 120 (note 1)(note 3) v maximum junction temperature tjmax + 150 c operating temperature range t opr - 40 to +105 c storage temperature tstr - 55 to +150 c (note 1) reference sr_gnd (note 2) reference sh_gnd (note 3) when a negative voltage is applied , current flows through the esd protection device . this current value is about 6ma or less and will require a current limiting resistor to the drain terminal caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p (note 4) sop8 junction to ambient ja 197.4 109.8 c /w junction to top characterization parameter (note 2) jt 21 19 c /w (note 1) based on jesd51-2a(still-air) (note 2) the thermal characterization parameter to report the differe nce between junction temperature and the temperature at the top ce nter of the outside surface of the component package. (note 3) using a pcb board based on jesd51- 3. (note 4) using a pcb board based on jesd51- 7. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70m layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70m 74. 2mm x 74.2mm 35m 74.2mm x 74.2mm 70m recommended operating conditions ( ta = 25c) parameter symbol min typ max unit supply voltage v cc 2. 7 20 32 v max_ton resistor range r max_ton 56 - 30 0 k max_ton r1 r 1 0.5 1 2 k max_ton c1 c 1 68 0 100 0 220 0 pf downloaded from: http:///
7/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf electrical characteristics (unless otherwise specified v cc = 20 v ta=25c) parameter symbol spec unit conditions min typ max circuit current circuit current1 i on1 0.5 1 2 ma f sw =50khz at switching mode (gate=open) circuit current at sleep m ode i sleep 60 120 200 a at shutdown mode circuit current at normal m ode i act 350 800 1400 a switching stop mode, circuit current at uvlo m ode i off 18 35 60 a v cc =1.9v vcc item vcc uvlo threshold voltage1 v uvlo1 2. 0 0 2.30 2.65 v v cc sweep up vcc uvlo threshold voltage2 v uvlo2 1.95 2.25 2.60 v v cc sweep down sr controller block gate turn on threshold v gon n - 150 - 100 - 50 mv v drain =- 300 mv to +300mv gate turn off threshold v go ff - 10 -6 -1 mv v drain =- 300 mv to +300mv compulsion on time (note 5) t con -9 - 9 % excluding bm1r00026- 30 and bm1r00146-150 which has no compulsion on time compulsion off time (note 5) t coff -9 - 9 % max_ton block max_ton timer start threshold voltage v max_on_start 24 28 32 v v cc =2 0v, drain terminal voltage max_ton timer t max_on 9. 4 10 10. 6 s r max_ton =100k , v cc =3v, v drain =-0.3 ? 7v max_ton output voltage v max_on 0.24 0.40 0.56 v auto shutdown block auto shutdown detect time t shd 120 200 320 s no pulse to drain terminal auto shutdown cancel pulse number p act - 265 - time input pulse to dran terminal drain monitor block drain sink current i d_sink 130 250 550 a v drain =120v drain terminal source current1 i drain_so1 - 23 - 11 -5 a v drain =0.1v drain terminal source current2 i drain_so2 -3 -1 -0.3 a v drain =-0.2v driver block gate terminal high voltage v gate_h1 11 12 14 v v cc =20v high side fet on-resistance (v cc =2.7 v) r hionr1 12.0 23.0 50.0 v cc =2.7v, i out = -10ma high side fet on-resistance (v cc =5v) r hionr2 6.0 12.0 24.0 v cc =5.0v, i out = -10ma high side fet on-resistance (v cc =10v) r hionr3 4.0 9.0 18.0 v cc =10v, i out = -10ma low side fet on-resistance (v cc =2.7 v) r lowonr1 1. 1 2.2 4.4 v cc =2.7v, i out = +10ma low side fet on-resistance (v cc =5v) r lowonr2 0.9 1.8 3.6 v cc =5.0v, i out = +10ma propagation delay to fet turn on t delay_on - 50 - ns v drain =-300mv to +300mv propagation delay to fet turn off t delay_off - 10 0 - ns v drain =-300mv to +300mv (note 5) see the lineup table in page1. downloaded from: http:///
8/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf electrical characteristics (unless otherwise specified v sh_out = 20 v ta=25c) parameter symbol spec unit conditions min typ max shunt regulator block (other chip) reference voltage v shref 0.796 0.800 0.804 v v sh_out =5v sh_out sink current=100a reference voltage changing ratio by temperature ? v shemp - -4 - mv v sh_out =5v sh_out sink current=100a temperature=25c to 105 c sh_out coefficient of the reference voltage1 ? v shref1 - 1 - mv v sh_out = 2. 7v to 5v sh_out sink current=100a sh_out coefficient of the reference voltage2 ? v shref2 - 2 - mv v sh_out =5v to 20v sh_out sink current=100a reference input current i sh_in -0.2 0.0 0.2 a v sh_in =2v dynamic impedance1 z sh_out1 - 0.3 - sh_out sink current =100a to 300a (v sh_out =2.7 v) dynamic impedance2 z sh_out2 - 0.2 - sh_out sink current =100a to 300a (v sh_out =20v) sh_out current at sh_in=low i sh_out 20 40 75 a v sh_in =0v, v sh_out =2 0v sh_out sink current i sh_out_min 1 - - ma v sh_in =0.85v, v sh_out = 2. 7v sh_in ovp detection voltage1 v shi_ovp1 0.90 1.00 1.10 v v sh_in = sweep up sh_in ovp detection voltage2 v shi_ovp2 0.85 0.95 1.05 v v sh_in = sweep down sh_out ovp detection voltage v sho_ovp1 32.5 35 37.5 v v sh_out sweep up sh_out ovp detection voltage2 v sho_ovp2 31.5 34 36.5 v v sh_out sweep down latch timer t latch2 100 200 300 s sh_out sink current at latch mode i latch_sh_in_ovp 1.3 2.5 5 ma v sh_out =5v , v sh_in =0v downloaded from: http:///
9/ 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf typical performance curves 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 input voltage vcc[v] circuit current i act [ma] ta=- 40 c ta= 105 c figure 3 . circuit current vs input voltage (stop switching state) ta=25 c input voltage : v cc [v] circuit current : i act [ma] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 input voltage vcc[v] circuit current i act [ma] figure 4. circuit curre nt vs input voltage (stop switching state vcc zoom) ta=- 40 c ta=25 c ta= 105 c input voltage : v cc [v] circuit current : i act [ma] 0 20 40 60 80 100 120 140 160 180 200 0 5 10 15 20 25 30 input voltage vcc[v] circuit current i sleep [ a ] ta=- 40 c ta= 105 c ta=25 c figure 5. circuit current vs input voltage (at shut down state) input voltage : v cc [v] circuit current : i sleep [a] 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 input voltage vcc[v] sh_out sink current i sh_out [ a ] ta=- 40 c ta= 105 c ta=25 c figure 6. circuit current vs sh_out voltage (v sh_in =0v) sh_out voltage : v sh_out [v] sh_out sink current : i sh_out [a] downloaded from: http:///
10 / 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf typical performance curves - continued 0.780 0.785 0.790 0.795 0.800 0.805 0.810 0.815 0.820 -40 -20 0 20 40 60 80 100 temperature ta [ ] sh_in voltage v shref [v] figure 7. sh_in voltage vs temperature (i sh_out =100 a) v sh_out =20v v sh_out =5v v sh_out =3v temperature : ta [c] sh_in voltage : v shref [v] vcc=20v vcc=5v vcc=3v 9.0 9.2 9.4 9.6 9.8 10.0 10.2 10.4 10.6 10.8 11.0 -40 -20 0 20 40 60 80 100 temperature ta [ ] max_ton timer t max_on [ s ] figure 8. max_ton timer vs temperature (r max_ton =100k , v drain =-0.3v<->vcc x 2) temperature : ta [c] max_ton timer : t max_on [s] v cc =20v v cc =5v v cc =3v -110 -105 -100 -95 -90 -40 -20 0 20 40 60 80 100 temperature ta [ ] gate on threshold voltage v gon [mv] figure 9. gate on threshold vs temperature (drain sweep down) temperature : ta [c] gate on threshold voltage : v gon [mv] -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 -40 -20 0 20 40 60 80 100 temperature ta [ ] gate off threshold voltagev goff [mv] figure 10. gate off threshold vs temperature (drain sweep up) temperature : ta [c] gate off threshold voltage : v goff [mv] v sh_out =20v v sh_out =5v v sh_out =3v v sh_out =20v v sh_out =5v v sh_out =3v downloaded from: http:///
11 / 22 tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00xxxf typical performance curves - continued 0 1000 2000 3000 4000 5000 740 760 780 800 820 840 860 sh_in voltage v sh_in [v] sh_out current i sh_out [ a] ta =105c v ta=25c ta=- 40 c figure 11. sh_out current vs sh_in voltage (v sh_out =5v) sh_ in voltage : v sh_in [m v] sh_out current : i sh_out [a] figure 12. sh_out current vs sh_in voltage (v sh_out =5v, zoom up) 0 50 100 150 200 250 300 760 780 800 820 840 sh_in voltage v sh_in [v] sh_out current i sh_out [ a] ta=105c ta=- 40 c ta=25c sh_ in voltage : v sh_in [m v] sh_out current : i sh_out [a] downloaded from: http:///
12 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 vout(vcc) reg4v(internal ic) vcc_uvlo 2.3v vcc=2.3v 4v 4v 5v ref1v (internal ic) 1v drain max_ton 0.4v gate 200us drain 265count auto_shutdown (internal ic) shutdown P 1.3v bg_0.5v (internal ic) 0.5v bg_ok (internal ic) 4v drv4v (internal ic) drain 4count drain 9count timing chart figure 13. start up sequence downloaded from: http:///
13 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 application examples built-in shunt regulator in the ic has been completely sep arated from internal and synchronous rectification control ic. therefore , the shunt regulator is possible to be used as a gnd reference in high side type of flyback application. figure 14 . flyback application circuit (low side fet) figure 15 . flyback application circuit (high side fet) + - v out gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton r max_ton r1 c1 c vcc r vcc c fb1 c fb2 r fb1 r fb2 r sh_out1 r sh_out2 pc1 c out m1 d 1 r drain1 r drain2 l fb + - v out gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton c fb2 r fb1 r fb2 r sh_out2 pc1 r vcc r sh_out1 c vcc c fb1 c out r max_ton r1 c1 m1 r drain1 r drain2 l fb d 1 downloaded from: http:///
14 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 regarding protection applications the built-in shunt regulator is high-voltage, low curren t consumption , high accuracy, and also suitable as a comparator fo r protection application . on the above current resonant circuit, the shunt regulator is used as an overvoltage protection circuit. figure 16 . resonant half-bridge application circuit + - v out gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton r drain1 c vcc1 c fb1 c fb2 r fb1 r fb2 r sh_out1 r sh_out2 pc1 c out m1 sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vccsh_out 7 sr_gnd max_ton c vcc2 c fb3 r fb3 r sh_out13 pc2 m2 r fb4 r drain3 r drain4 l fb2 d 2 r drain2 l fb1 d 1 shunt regulator used as overvoltage (ovp) protection disable max_ton by pulling up to vcc if not in continuous mode operation such as in current resonance and quasi-resonant applications shunt regulator used in feedback operation downloaded from: http:///
15 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 56k 100k 300k 30u 25.5u 34.5u 10.0u 10.6u 9.4u 5.6u 4.7u 6.5u max_ton resistor [ohm] max_ton timer [s] selection of externally connected components 1. max_ton pin setting a resistance value which is connected to the max_ton termi nal is used to set the timer to force the gate output off. (for detailed operation, please see "each block operation / max_ton blocks") set timer is proportional to the resistance value which can b e set in the range of 56k to 300k. this ic is capable of an accuracy of 10us 6 % at 100k . however, accuracy deteriorates as the resistance value get s further away from 100k. for example, 5.6s 0.9 s at 56k, 30s 4.5s at 300k. (see graph below) to prevent destruction due to surge current in continuous m ode, set the max_ton timer before turning on the primary side fet (g 1 ) to forcibly off the secondary side fet (g 2 ). regarding such variations , select a resistance value of max_ton terminal so that the max_on timer setting time is les s than one cycle in the primary side (t p > t max_on ). - the primary side of the maximum frequency = f max [hz] - the primary side of the maximum frequency accuracy = ? f max [%] - the primary side of the jitter frequency = f jitter [hz] - secondary side max_ton timer time = t max_on - secondary side max_ton timer time accuracy = ? t max_on - secondary side max_ton when the connection resistance accuracy = ? r 2. calculation example primary side frequency 100khz 5% primary side jitter frequency 8khz secondary side max_ton timer accuracy = 7% secondary side max_ton connection resistance accuracy = 1% with these conditions, max_ton resistor(r max_ton ) should be set to 81 k or less. in addition, it is recommended that the temperature characteristics of each component should also be t aken into account. figure 17. max_ton timer vs max_ton resistor (r max_ton ) figure 18 . primary fet and secondary fet sequence at ccm mo de r max_ton [k ? ] < 10000 [k ? ][ khz] (1+ ? t max_on [%]+ ? r[%] + ? f max [%])(f max [khz]+f jitter [khz]) r max_ton [k ? ] < 10000 [k ? ][ khz] (1+5%+1%+7%)(100khz+8khz) = 81.94 [k ? ] frequency variation ratio maximum frequency value g1 t max_on max_ton timer compulsion off timer start g2 tp jitter set the max_ton timer so that the fet of the primary side (g 1 ) and the secondary side (g 2 ) is not simultaneous ly on t max_on t p g 1 g 2 downloaded from: http:///
16 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 i/o equivalent circuits pin 1: vcc / pin 6: gate / pin 7: sr_gnd pin 8: drain sr block internal reg 6.gate 7.sr_gnd 1.vcc 8.drain 7.sr_gnd pin 2: sh_in / pin 3: sh_out / pin 4: sh_gnd pin 5: max_ton 2.sh_in 4.sh_gnd 3.sh_out 5.max_ton internal reg downloaded from: http:///
17 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 notes on the layout (1) vcc line may malfunction under the influence of switching noise. therefore, it is recommended to insert a capacitor c vcc between the vcc and sr_g nd terminal. (2) sh_in terminal is a high impedance line . to avoid crosstalk, electric al wiring should be as short as possible and not in parallel with the switching line. (3) max_ton terminal has a 0.4v output . the external components of the max_ton terminal affects th e forced off time due to switching. thus, r1 and c1 should be connected to max_t on terminal as near as possible. it is also recommended to use an independent electrical wiring in connection with sr_gnd terminal. (4) the synchronous rectification controller ic must accurate ly monitor the v ds generated in the fet. accordingly, the electrical wiring between the drain to drain and sr_gnd to source of the ic and fet respe ctively should be connected independently. (5) the sh_gnd of the shunt regulator and the feedback resis tors of v out are recommended to be connected to the gnd of the output with an independent electrical wiring. (6) the drain terminal is a 0 ?100v switching line. use a narrow wiring and connect as short as p ossible. (7) use an independent wiring if connecting a snubber circuit between the ds of the fet. the connection of the tran sformer output and the source of the fet should be thick and short as possibl e. (8) due to the drain pin detects the small voltage, a malfunction whic h the switch turns on/off caused by the surge voltage may occur. so that, the filters such as the ferrite bead are recomm ended for alleviating the surge voltage. configuration example (note 6) : l fb 1 ( a ferrite bead for suppressing the surge voltage) : mmz1608s202a d 1 ( a schottky barrier diode) : rb751g- 40 r drain1 ( a filter resistor for the fet turn off ) : 0.3k - 2k r drain2 ( a current limiting resistor to the drain terminal) : 15 0 ? (note 6) the value i s not a guaranteed value, but for reference . please choose the optimum values of the components after sufficient evaluations based on the actual application. l fb1 + - v out gnd sh_in gate sh_gnd drain 8 6 5 1 2 3 4 vcc sh_out 7 sr _ gnd max_ ton r max_ton r1 c1 c vcc r vc c c fb1 c fb 2 r fb 1 r fb 2 r sh_ out1 r sh_ ou t2 pc1 c out m 1 rsnb csnb (7) (6) (5) (4) (3) (2) (1) (5) d 1 r drain1 r drain2 (8) figure 19 . flyback application circuit (low side fet) downloaded from: http:///
18 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage th e ic. take precautions against re verse polarity when connecting the power supply, such as mounting an external diod e between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolytic capacitors. 3. ground voltage except for pins the output and the input of which were design ed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even durin g transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tr aces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the gro und traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ra ting be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expe cted ch aracteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and de lays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling cap acitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or remo ving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input terminals input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small cha rge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifi ed, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
19 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 operational notes - continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) should be avoided. figure 20 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and th e maximum junction temperature rating are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) bm1r00 121 f C bm1r00150f (auto restart protection series) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate th e tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to n ormal operation. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or fo r any purpose other than protecting the ic from heat damage. bm1r00 001 f C bm1r00030f (latch protection series) this ic has a built-in thermal shutdown circuit that preve nts heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. the ic shou ld be powered down and turned on again to resume normal operation becaus e the tsd circuit keeps the outputs at the off state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or fo r any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
20 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 bm1r00001 00001 1 1.3 bm1r00002 00002 1 2 bm1r00003 00003 1 3 bm1r00004 00004 1 3.6 bm1r00005 00005 1 4.6 bm1r00006 00006 1.5 1.3 bm1r00007 00007 1.5 2 bm1r00008 00008 1.5 3 bm1r00009 00009 1.5 3.6 bm1r00010 00010 1.5 4.6 bm1r00011 00011 2.3 1.3 bm1r00012 00012 2.3 2 bm1r00013 00013 2.3 3 bm1r00014 00014 2.3 3.6 bm1r00015 00015 2.3 4.6 bm1r00016 00016 2.8 1.3 bm1r00017 00017 2.8 2 bm1r00018 00018 2.8 3 bm1r00019 00019 2.8 3.6 bm1r00020 00020 2.8 4.6 bm1r00021 00021 3.5 1.3 bm1r00022 00022 3.5 2 bm1r00023 00023 3.5 3 bm1r00024 00024 3.5 3.6 bm1r00025 00025 3.5 4.6 bm1r00026 00026 none 1.3 bm1r00027 00027 none 2 bm1r00028 00028 none 3 bm1r00029 00029 none 3.6 bm1r00030 00030 none 4.6 compulsion on time ( s compulsion off time ( s function name part number marking bm1r00121 00121 1 1.3 bm1r00122 00122 1 2 bm1r00123 00123 1 3 bm1r00124 00124 1 3.6 bm1r00125 00125 1 4.6 bm1r00126 00126 1.5 1.3 bm1r00127 00127 1.5 2 bm1r00128 00128 1.5 3 bm1r00129 00129 1.5 3.6 bm1r00130 00130 1.5 4.6 bm1r00131 00131 2.3 1.3 bm1r00132 00132 2.3 2 bm1r00133 00133 2.3 3 bm1r00134 00134 2.3 3.6 bm1r00135 00135 2.3 4.6 bm1r00136 00136 2.8 1.3 bm1r00137 00137 2.8 2 bm1r00138 00138 2.8 3 bm1r00139 00139 2.8 3.6 bm1r00140 00140 2.8 4.6 bm1r00141 00141 3.5 1.3 bm1r00142 00142 3.5 2 bm1r00143 00143 3.5 3 bm1r00144 00144 3.5 3.6 bm1r00145 00145 3.5 4.6 bm1r00146 00146 none 1.3 bm1r00147 00147 none 2 bm1r00148 00148 none 3 bm1r00149 00149 none 3.6 bm1r00150 00150 none 4.6 function name part number marking compulsion on time ( s compulsion off time ( s ordering information b m 1 r 0 0 x x x f - e 2 part number package f: sop8 packaging and forming specification e2: embossed tape and reel ( sop8 ) marking diagram part number marking package orderable part number 00xxx sop8 bm1r00xxxf- e2 sop8 (top view) part number marking lot number 1pin mark latch protection series auto restart protection series downloaded from: http:///
21 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 physical dimension, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
22 / 22 bm1r00xxxf tsz02201-0f4f0a2bm1r0-1-2 ? 2016 rohm co., ltd. all rights reserved. 20. apr. 2016 rev.002 www.rohm.com tsz22111 ? 15 ? 0 01 revision history date revis ion changes 2.mar.2016 00 1 data sheet revision1 release. 20. apr. 2016 002 modification: p4, p5 vout->vcc 20.apr. 2016 002 modification: p6, 74.2mm2->74.2mm x 74.2mm 20.apr. 2016 002 modification: p15, fig17 graph. downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///

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